WebSep 27, 2022 · To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal...
WebMay 8, 2023 · To address the urgent need for higher-performance TIMs to overcome future thermal management challenges of electronic devices, a roadmap is outlined for the...
WebThe thermal resistance of pure indium (200 μm-thick) and LM/In/LM pads with the same indium and LMs with different thickness was measured at 80 °C and 50 psi, as shown in Fig. 4(a).The pure indium...
WebDec 4, 2022 · High‐Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion - Wang - 2023 - Advanced Materials Interfaces -...
WebSep 8, 2021 · Thermal interface materials (TIMs) between heat source and heat sink, are important to guarantee stable and sufficient heat dissipation from heat source to heat...
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