Cooling Conductive Gap Heatsink Thermal Pad
High compressibility and compliancy
Natural tack
Product Details
Products Description
Cooling conductive gap heatsink thermal pad has a certain degree of flexibility, excellent insulation, compressibility, and natural viscosity on the surface. A thermal pad is specially produced for the design of using the gap to transfer heat. It can fill the gap and complete the heat between the heating part and the heat dissipation part.
Cooling conductive gap heatsink thermal pad also plays the role of insulation, shock absorption, sealing, etc., which can meet the design requirements of equipment miniaturization. It is extremely manufacturable and practical and has a wide range of thicknesses. A thermal gap pad is an excellent thermally conductive filler material. It is widely used in electronic and electrical products.
Feature
1. Excellent thermal conductivity, high insulation performance
2. Best thermal pads does not contain any harmful substances
3. High and low-temperature resistance, high compression
4. Convenient operation, easy assembly, and repeatable disassembly
5. It can replace thermal grease which is easy to volatile pollution
6. Can be used to fill structural gaps
Product Properties
Item | NKS-###-PAD-TC | NKS-###-PAD-MTC | NKS-###-PAD-HTC | Test Method |
Reinforced Carrier | N/A | N/A | N/A | --- |
Pad Type | Silicone Polymer | Silicone Polymer | Silicone Polymer | --- |
Thickness(mm) | 0.30~12.00 | 0.30~5.0 | 0.30~3.0 | ASTM D 374 |
Color | Grey/Pink/Blue/Black | Grey/Pink/Blue/Black | Grey/Pink/Blue/Black | VISUAL |
Density(g/cc) | 1.8~2.8 | 3.0 | 3.2~3.5 | ASTM D792 |
Hardness(Shore C) | 30±5 | 25±5 | 25±5 | ASTM D2240 |
Thermal Conductivity(W/m-k) | 1.0~2.5 | 2.0~3.0 | 3.0~15.0 | ASTM D2240 |
Voltage Resistance(KV/mm) | >4.0 | >4.0 | >4.0 | ASTM D149 |
Temperature Resistance (℃/℉) | -40~+220(℃) -104~+428(℉) | -40~+220(℃) -104~+428(℉) | -40~+220(℃) -104~+428(℉) | ASTM D5470 |
Volume Resistance(Ω NaN) | 1.0*1011 | 3.1*1011 | 3.1*1011 | ASTM D257 |
Flame Rating | V-0 | V-0 | V-0 | UL-94 |
Standard Size(mm) | 200*400/320x320(Customized Available) |
Application
1. Motherboard
2. High-power industry
3. LED lighting industry
4. New energy industry
5. LED backlight module
6. Memory storage module
Service
1. Provide free samples and OEM/ODM design, Die cutting service
2. Welcome factory visit, passed SGS, ROHS, ISO9001, ISO14001, and IATF16949 certificates
3. Skilled workers and strict quality inspection(QA Report)
4. Have experience in supplying Amazon sellers
5. Small MOQ: 100pcs to start
Product Properties
Item | NKS-###-PAD-TC | NKS-###-PAD-MTC | NKS-###-PAD-HTC | Test Method |
Reinforced Carrier | N/A | N/A | N/A | --- |
Pad Type | Silicone Polymer | Silicone Polymer | Silicone Polymer | --- |
Thickness(mm) | 0.30~12.00 | 0.30~5.0 | 0.30~3.0 | ASTM D 374 |
Color | Grey/Pink/Blue/Black | Grey/Pink/Blue/Black | Grey/Pink/Blue/Black | VISUAL |
Density(g/cc) | 1.8~2.8 | 3.0 | 3.2~3.5 | ASTM D792 |
Hardness(Shore C) | 30±5 | 25±5 | 25±5 | ASTM D2240 |
Thermal Conductivity(W/m-k) | 1.0~2.5 | 2.0~3.0 | 3.0~15.0 | ASTM D2240 |
Voltage Resistance(KV/mm) | >4.0 | >4.0 | >4.0 | ASTM D149 |
Temperature Resistance (℃/℉) | -40~+220(℃) -104~+428(℉) | -40~+220(℃) -104~+428(℉) | -40~+220(℃) -104~+428(℉) | ASTM D5470 |
Volume Resistance(Ω NaN) | 1.0*1011 | 3.1*1011 | 3.1*1011 | ASTM D257 |
Flame Rating | V-0 | V-0 | V-0 | UL-94 |
Standard Size(mm) | 200*400/320x320(Customized Available) |
Hot Tags: cooling conductive gap heatsink thermal pad suppliers China, manufacturers, factory, price, made in China,
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