Double-Sided High-Temperature Polyimide Silicone Adhesive Kapton Tape

Product Description

Double-sided high-temperature polyimide silicone adhesive Kapton tape is made of polyimide film, coated with high-temperature resistant silicone adhesive.

Double-sided high-temperature polyimide silicone adhesive Kapton tape mainly used automotive sensors and manifolds, insulating circuit boards, Etching, Fiber Optics Cable, High-temperature powder coating, Semiconductor manufacturing wait.

Features

* Provide excellent electrostatic dissipation

* Provide high-temperature resistance

* leave no adhesive residue after remove

* Dimensionally stable at high Temperature.

* Designed to minimize static effect during striping and peeling. 

Construction

Silicone Adhesive Polyimide Film Silicone Adhesive Release Film

CertificateApplication Guidelines

1.) Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or fingerprints. Do not use “denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK), or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.

Note: Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents.

2.) Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller, or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.

3.) Assemble the part by applying compression to the substrates to ensure good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon the design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. The use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrates can conform to the other substrates.

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