Thermally Conductive Adhesive Tapes
* High thermal conductivity
* Strong stickiness
* Easy to assemble
Product Details
Product Description
NKS series thermally conductive adhesive tapes are made of advanced thermal conductive PSA. They satisfy the demand for high adhesion and excellent thermal conductive efficiency by providing a preferential heat-transfer path between heat-generating components and heat sink or other cooling devices.
Key Features:
★ High tacky thermal conductive PSA. The only pressure is needed to form an excellent bond and thermal interface.
★ The performance of thermal conductivity, insulation, buffer, and high tacky make it the best choice for an electronic application.
★ Flexible and conformable. Ideal for uneven surfaces.
★ Thermal tape is stable and economical with different thicknesses and constructions.
Product Construction:
Specification
Item | NKS-## | NKS-##N | Test Method |
Carrier | Glass Fabric | N/A | --- |
Adhesive | Thermally Conductive PSA | Thermally Conductive PSA | --- |
Total thickness (mm) | 0.10~0.50 | 0.05~0.40 | ASTM D374 |
Color | White | White | VISUAL |
Release Liner | Blue PE Film | White Release Paper | VISUAL |
Adhesion (N/25mm) | 12~18 | 12~18 | PST-101 |
Thermal Conductivity(W/m-k) | 1.2 | 1.2 | ASTM D22470 |
Voltage Resistance(KV/mm) | 3.5~8.0 | 3.5~8.0 | ASTM D149 |
Temperature Resistance(Short Term,℃/℉) | 120(℃) 248(℉) | 120(℃) 248(℉) | EN344 |
Temperature Resistance(Long Term,℃/℉) | 80(℃) 176(℉) | 80(℃) 176(℉) | EN344 |
Standard width (mm) | 2~1030(Customized Available) | ||
Standard length (m) | 25/50(Customized Available) |
Notice: The above were reference values. For detailed information, please contact China Heat Resistant Tape.
Application Ideas:
★ Thermal adhesive tape can be used on the assembly of the LED light bar module and metal frame bezel.
★ Thermally conductive adhesive tapes can be used in the assembly of the DDR-RAM module and heat sink.
★ Electronic components: IC, COP, CPU, MOS, etc.
★ Double-sided thermal tape applies to M/B, PS, PCB, LCD, PDP, PC, etc. Product Construction.
How To Use
Just stick on the surface of any object and tear the blue release paper, which can be tightly and firmly agglutination on the heat source devices and heat sink to speed the heat dissipation.
Our Advantages:
• Well Competitive Prices and High-Quality Control
• Prompt Delivery
• Earth-friendly Products
• In a Variety of Design
• Small Order Acceptable
• OEM Accepted
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