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Home > Tags > Thermal Tape > Thermal Silicone Pad

Soft Thermal Conductive Silicone Pad Without Reinforcement

* Excellent thermal conductivity
* Soft and flexible
* SGS and UL compliance
* Self-adhesive, natural sticky, no extra surface added adhesives

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Product Description

Soft thermal conductive silicone pad without reinforcement is high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or product outer covering.

Features

* Excellent thermal conductivity

* Self-adhesive, natural sticky, no extra surface added adhesives

* Soft and flexible

* SGS and UL compliance

Application

Soft thermal conductive silicone pad without reinforcement is mainly used in Communication Equipment, LED lighting, Switch power supply, Backlight modules, Medical equipment, Mobile equipment, Video equipment, Networking equipment, Household equipment, PC server/ workstations, etc.

Application Modes

* Filling between PCB and heat sink

* Filling between IC and heat sink or product outer covering

* Filling between IC and other cooling devices

Physical Properties

Item	NKS-###-PAD-TC	NKS-###-PAD-MTC	NKS-###-PAD-HTC	Test Method
Reinforced Carrier	N/A	N/A	N/A	---
Pad Type	Silicone Polymer	Silicone Polymer	Silicone Polymer	---
Thickness（mm）	0.30~12.00	0.30~5.0	0.30~3.0	ASTM D374
Color	Grey/Pink/Blue/Black	Grey/Pink/Blue/Black	Grey/Pink/Blue/Black	VISUAL
Density(g/cc)	1.8~2.8	3.0	3.2~3.5	ASTM D792
Hardness(Shore C)	30±5	25±5	25±5	ASTM D2240
Thermal Conductivity(W/m-k)	1.0~2.5	2.0~3.0	3.0~6.0	ASTM D2240
Voltage Resistance(KV/mm)	＞4.0	＞4.0	＞4.0	ASTM D149
Temperature Resistance（℃/℉）	-40~+220(℃) -104~+428(℉)	-40~+220(℃) -104~+428(℉)	-40~+220(℃) -104~+428(℉)	ASTM D5470
Volume Resistance(Ω .cm)	1.0*1011	3.1*1011	3.1*1011	ASTM D257
Flame Rating	V-0	V-0	V-0	UL-94
Standard Size（mm）	200*400/320x320(Customized Available)

These values are measured values and not guaranteed value