Thermal Pad 1mm 2mm 3mm

* Good Heat Dissipation
* Soft, good malleability
* Strong insulation and Excellent performance
* Improve the efficiency and service life of heating components

Product Details

Product Description

Thermal pad 1mm 2mm 3mm is a kind of thermal interface with high performance. It is soft, self-sticky, and elastic. It can fill the gap between heat-generating components and heat sink, metal mechanism, and shell or other cooling devices. The heat can be transferred out speedily so as to improve the electronic components' working efficiency and prolong the lifespan of the equipment.

Feature

* The thermal pad is sticky, with good conduction, you can easily put it on IC Chipset and heatsink, you can also fix it on LED IC SMD DIP or elsewhere.

* Soft, good malleability, with a little viscosity.

* Strong insulation and Excellent performance.

* Provide a mess-free installation, maximum heat conduction, and increased cooling.

* Soft thermal conductive silicone Pad reduces the effectiveness of your heatsink and raises the operating temperature of your processor/video card.

Physical Properties

Item	NKS-###-PAD-TC	NKS-###-PAD-MTC	NKS-###-PAD-HTC	Test Method
Reinforced Carrier	N/A	N/A	N/A	---
Pad Type	Silicone Polymer	Silicone Polymer	Silicone Polymer	---
Thickness（mm）	0.30~12.00	0.30~5.0	0.30~3.0	ASTM D 374
Color	Grey/Pink/Blue/Black	Grey/Pink/Blue/Black	Grey/Pink/Blue/Black	VISUAL
Density(g/cc)	1.8~2.8	3.0	3.2~3.5	ASTM D792
Hardness(Shore C)	30±5	25±5	25±5	ASTM D2240
Thermal Conductivity(W/m-k)	1.0~2.5	2.0~3.0	3.0~6.0	ASTM D2240
Voltage Resistance(KV/mm)	＞4.0	＞4.0	＞4.0	ASTM D149
Temperature Resistance （℃/℉）	-40~+220(℃) -104~+428(℉)	-40~+220(℃) -104~+428(℉)	-40~+220(℃) -104~+428(℉)	ASTM D5470
Volume Resistance(Ω NaN)	1.0*10¹¹	3.1*10¹¹	3.1*10¹¹	ASTM D257
Flame Rating	V-0	V-0	V-0	UL-94
Standard Size（mm）	200*400/320x320(Customized Available)

Notice: The above were reference values. For detailed information, please contact China Heat Resistant Tape.

Application

Thermal pad 1mm 2mm 3mm can be used for CPU, GPU, IC, PS3, PS2, graphics card, high speed hard drive, memory module, micro heat pipe radiators, automobile engine control devices, communication hardware, laboratory equipment, and many other portable electronic devices. This is like a miniature version of the heat sink.

Thermal Pad