* Strong Stickiness
* Easy To Assemble
* Excellent Insulation
* Excellent Thermal Conductivity
Product Description
Thermal adhesive tape is made of advanced thermal conductive PSA. They satisfy the demand for high adhesion and excellent thermal conductive efficiency by providing a preferential heat-transfer path between heat-generating components and heat sink or other cooling devices.
Features
* Thermal adhesive tape has excellent thermal conductivity to easily transfer heat.
* Thermal conductive tape's strong stickiness provides a sturdy and firm stickiness to prevent falling off.
* Superior quality with service time in working temperature.
* Thermal conductive adhesive tape's excellent insulation feature eliminates any risks of causing a short circuit.
Product Construction
Specification
Item | NKS-## | NKS-##N | Test Method |
Carrier | Glass Fabric | N/A | --- |
Adhesive | Thermally Conductive PSA | Thermally Conductive PSA | --- |
Total thickness (mm) | 0.10~0.50 | 0.05~0.40 | ASTM D374 |
Color | White | White | VISUAL |
Release Liner | Blue PE Film | White Release Paper | VISUAL |
Adhesion (N/25mm) | 12~18 | 12~18 | PST-101 |
Thermal Conductivity(W/m-k) | 1.2 | 1.2 | ASTM D22470 |
Temperature Resistance(Short Term,℃/℉) | 120(℃) 248(℉) | 120(℃) 248(℉) | EN344 |
Temperature Resistance(Long Term,℃/℉) | 80(℃) 176(℉) | 80(℃) 176(℉) | EN344 |
Standard width (mm) | 2~1030(Customized Available) | ||
Standard length (m) | 25/50(Customized Available) |
Application
Thermal adhesive tape with a high coefficient for thermal conduction on electronic components, like controller, semiconductor, MOS, IC, GBT, SSD, computer CPU, GPU, RAM & DDR memory modules, and so on; easy mountings to replace screws for electronic components to increase the work efficiency, printing industry, filling the gap on uneven surfaces of electronic components for a tight fit, holding LED strips and etc.
Usage
Just stick on the surface of any object and tear the blue release paper, which can be tightly and firmly conglutinate on the heat source devices and heat sink to speed the heat dissipation.
Note All data contained in this document are based on the china standard test method, they are average values, they should not be used for a specific purpose. All statements, technical information, and recommendations contained are based upon tests that we believe are reliable, but we strongly recommend clients should do their own tests and decide whether the product is fit for a particular purpose or the method of application.
If you want to customize your goods, you can let our salesman know your requirements, they will give you some suggestions. For example film thickness, glue thickness, paper core, packing, carton design, and any other things.
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