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FAX: +86-592-7152858
E-mail: inquiry-tape@winnewtech.com
Address: Building 2, Hongqiaotou Industrial Zone, Songgang, Baoan, Shenzhen, China. 518127
Cooling Conductive Gap Heatsink Thermal Pad

Cooling Conductive Gap Heatsink Thermal Pad

Very good thermal conductivity
High compressibility and compliancy
Natural tack

 

Products Description

Cooling conductive gap heatsink thermal pad has a certain degree of flexibility, excellent insulation, compressibility, and natural viscosity on the surface. A thermal pad is specially produced for the design of using the gap to transfer heat. It can fill the gap and complete the heat between the heating part and the heat dissipation part. 

Cooling conductive gap heatsink thermal pad also plays the role of insulation, shock absorption, sealing, etc., which can meet the design requirements of equipment miniaturization. It is extremely manufacturable and practical and has a wide range of thicknesses. A thermal gap pad is an excellent thermally conductive filler material. It is widely used in electronic and electrical products.

Feature

1. Excellent thermal conductivity, high insulation performance

2. Best thermal pads does not contain any harmful substances

3. High and low-temperature resistance, high compression

4. Convenient operation, easy assembly, and repeatable disassembly

5. It can replace thermal grease which is easy to volatile pollution 

6. Can be used to fill structural gaps

Product Properties

Item

NKS-###-PAD-TC

NKS-###-PAD-MTC

NKS-###-PAD-HTC

Test Method

Reinforced Carrier

N/A

N/A

N/A

---

Pad Type

Silicone Polymer

Silicone Polymer

Silicone Polymer

---

Thickness(mm)

0.30~12.00

0.30~5.0

0.30~3.0

ASTM D 374

Color

Grey/Pink/Blue/Black

Grey/Pink/Blue/Black

Grey/Pink/Blue/Black

VISUAL

Density(g/cc)

1.8~2.8

3.0

3.2~3.5

ASTM D792

Hardness(Shore C)

30±5

25±5

25±5

ASTM D2240

Thermal Conductivity(W/m-k)

1.0~2.5

2.0~3.0

3.0~15.0

ASTM D2240

Voltage Resistance(KV/mm)

>4.0

>4.0

>4.0

ASTM D149

Temperature Resistance

(℃/℉)

-40~+220(℃)

-104~+428(℉)

-40~+220(℃) -104~+428(℉)

-40~+220(℃)

-104~+428(℉)

ASTM D5470

Volume Resistance(Ω NaN)

1.0*1011

3.1*1011

3.1*1011

ASTM D257

Flame Rating

V-0

V-0

V-0

UL-94

Standard Size(mm)

200*400/320x320(Customized  Available)

Application
thermal pad material.jpg

1. Motherboard

2. High-power industry

thermal pad tape.jpg

3. LED lighting industry

4. New energy industry

conductive pad.jpg

5. LED backlight module

6. Memory storage module

Service

1. Provide free samples and OEM/ODM design, Die cutting service 

2. Welcome factory visit, passed SGS, ROHS, ISO9001, ISO14001, and IATF16949 certificates 

3. Skilled workers and strict quality inspection(QA Report)

4. Have experience in supplying Amazon sellers 

5. Small MOQ: 100pcs to start

Hot Tags: cooling conductive gap heatsink thermal pad suppliers China, manufacturers, factory, price, made in China,

Product Properties

Item

NKS-###-PAD-TC

NKS-###-PAD-MTC

NKS-###-PAD-HTC

Test Method

Reinforced Carrier

N/A

N/A

N/A

---

Pad Type

Silicone Polymer

Silicone Polymer

Silicone Polymer

---

Thickness(mm)

0.30~12.00

0.30~5.0

0.30~3.0

ASTM D 374

Color

Grey/Pink/Blue/Black

Grey/Pink/Blue/Black

Grey/Pink/Blue/Black

VISUAL

Density(g/cc)

1.8~2.8

3.0

3.2~3.5

ASTM D792

Hardness(Shore C)

30±5

25±5

25±5

ASTM D2240

Thermal Conductivity(W/m-k)

1.0~2.5

2.0~3.0

3.0~15.0

ASTM D2240

Voltage Resistance(KV/mm)

>4.0

>4.0

>4.0

ASTM D149

Temperature Resistance

(℃/℉)

-40~+220(℃)

-104~+428(℉)

-40~+220(℃) -104~+428(℉)

-40~+220(℃)

-104~+428(℉)

ASTM D5470

Volume Resistance(Ω NaN)

1.0*1011

3.1*1011

3.1*1011

ASTM D257

Flame Rating

V-0

V-0

V-0

UL-94

Standard Size(mm)

200*400/320x320(Customized  Available)

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