Wafer UV Dicing Tape Tape compared to the average tape, the surface changed to paper. Stickiness of Wafer UV Dicing Tape is not strong, so the advantage of Wafer UV Dicing Tape is that there will be no residue after torn off.Wafer UV Dicing Tape is now generally made of a variety of colors, Wafer UV Dicing Tape is widely used in the paste paper, landscaping, layout and other purposes.
Good initial tackiness, good tackiness, easy adhesion to all kinds of surfaces of Wafer UV Dicing Tape, low labor intensity, can be masking film ~ masking paper firmly fixed in the required position, to avoid sliding, falling off and so on.
Masking paper back base of Wafer UV Dicing Tape: uniform thickness, good adhesion, the tape around the corner is not broken.
Back guess infiltration infiltration of Wafer UV Dicing Tape: dense material, good anti-solvent ability, easy to tear, not easy to break, the whole tape can be removed after use.
Anti-sticking of backing material: Small and uniform unwinding force, no excessive unwinding, easy to use with concealed sheets on special cutters.
