The thermal pad has good thermal conductivity and a high level of pressure resistance. It is an alternative product to replace thermal grease. The material itself has a certain degree of flexibility. It fits well between the power device and the aluminum heat sink or the machine shell to achieve The best heat conduction and heat dissipation purpose, in line with the 21st-century electronic industry's requirements for heat conduction materials, is the best product to replace the binary heat dissipation system of thermal grease and thermal grease plus mica sheet. In the industry, it can also be called thermally conductive silicone sheets, thermally conductive silicone pads, thermally conductive silicone pads, insulating thermal pads, flexible heat dissipation pads, and so on.
As electronic devices continue to integrate more powerful functions into smaller components, temperature control has become one of the most important challenges in the design, that is, how to effectively take away when the architecture is shrinking and the operating space is getting smaller and smaller. The more heat generated by the greater unit power. Designers have been working to improve the CPU speed and processing power of various servers, which requires microprocessors to continuously improve heat dissipation performance. But in other application fields, such as video game consoles, graphics equipment, and digital applications that require higher performance to support high-definition images, there is also a demand for stronger computing performance. As a result, chip manufacturers are paying more attention than ever to thermally conductive materials (thermally conductive pads) and other technologies that can take away excess heat, which has an adverse effect on component stability and lifespan. As we all know, the operating temperature of the junction has a great influence on the durability of the circuit (transistor), and a small decrease in temperature (10°C-15°C) can double the life of the device. The lower operating temperature can also shorten the signal delay, thereby helping to increase the processing speed. In addition, the lower temperature can also reduce the idle power dissipation (dissipated power) of the equipment, which can reduce the total power dissipation and heat dissipation.
The thermal pad is designed from an engineering perspective to simulate how to match the irregular surface of the material, use high-performance thermal conductive materials and eliminate air gaps, thereby improving the overall heat transfer capability and enabling the device to work at a lower temperature.
