Types of Thermal Tape Are Available In Various Formats

Thermal tape is a double-sided adhesive tape used in a wide variety of applications. It acts as a mechanical fastener, but also as a thermal interface material (TIM) to move heat between the components. Its conductive properties are ideal for moving LED lights and other electronics to heat sinks, which in turn transfer more heat away from the source.

Thermal tapes for thermal management and heat dissipation between electronic components and cooling devices such as fans, heat spreaders, or heat sinks. They are thin and conformable and have high conductivity and bonding strengths. They are easy to apply and remove and can be applied directly to the heat sink or other components. They can be slit to non-standard widths or die-cut to meet specific applications and assembly requirements.

There are a few different types of adhesive tapes that can be used to attach heat sinks to chips. One is called thermal tape, and it is typically chosen when the heat sink does not have a retention system to stay in place. Another is called thermal paste, which is used to fill microscopic gaps in the surface of a chip and the heatsink.

Thermal Paste is the most common type of thermal adhesive and it has a long history as a reliable thermal conductor. It is inexpensive and has strong initial performance, but its long-term performance can degrade. It may also be messy and difficult to clean.

Thermally conductive adhesive tapes provide low thermal resistance and superior thermal conductivity for heat sink bonding, integrated circuit packaging, and other applications. They are free from the six restricted materials in the RoHS Directive and offer high adhesion to low surface energy substrates.

Thermal tape is a high-performance thermal interface adhesive that provides exceptional bonding characteristics between electronic components and heat sinks, reducing the need for mechanical fasteners. It is available in various formats such as sheets, rolls, and die-cut parts, and has proven reliability under a variety of thermal and mechanical stresses.